Patent Assignment
Reel/Frame 058588/0626
Assignment of Assignor's Interest
Recorded: 2022-01-10
Pages: 4
Assignors
HSU, CHIA-KUEI
Executed: 2021-11-29
YEW, MING-CHIH
Executed: 2021-11-29
YEH, SHU-SHEN
Executed: 2022-01-07
LIN, PO-YAO
Executed: 2021-11-29
JENG, SHIN-PUU
Executed: 2021-11-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Die Corner Removal for Molding Compound Crack Suppression in Semiconductor Die Packaging and Methods for Forming the Same