Patent Assignment
Reel/Frame 058595/0645
Assignment of Assignor's Interest
Recorded: 2021-12-28
Pages: 4
Assignors
MENG, ZHAOSHENG
Executed: 2021-11-23
WU, ZHUANGZHUANG
Executed: 2021-11-23
CHI, MIN-HWA
Executed: 2021-11-23
Assignee
SIEN (QINGDAO) INTEGRATED CIRCUITS CO., LTD.
NO. 1088, SHANGWANGHE ROAD, WEST COAST NEW AREA,, QINGDAO, SHANGDONG, 266426, CHINA
Covered Property
(1)
Liner and Barrier Layer in Dual Damascene Cu Interconnect for Enhanced Em and Process