Patent Assignment
Reel/Frame 058596/0594
Assignment of Assignor's Interest
Recorded: 2022-01-10
Pages: 4
Assignors
BRADLEY, EDWIN L
Executed: 2022-01-07
SUPPELSA, ANTHONY J
Executed: 2022-01-07
MEYER, DAVID J
Executed: 2022-01-06
Assignee
MOTOROLA SOLUTIONS, INC.
500 WEST MONROE STREET, CHICAGO, ILLINOIS, 60661
Covered Property
(1)
Solder Pads with Concave Edges for Ball Grid Arrays