IP Library › Assignment 058597/0419
Patent Assignment
Reel/Frame 058597/0419

Assignment of Assignor's Interest

Recorded: 2021-12-28 Pages: 6
Assignors
YEE, WU AIK
Executed: 2020-06-08
LEE, EDWARD L.
Executed: 2020-05-31
GOH, HWEE LUN
Executed: 2020-06-17
Assignee
DOW CHEMICAL PACIFIC (SINGAPORE) PRIVATE LIMITED
260 ORCHARD ROAD, 18-01 THE HEEREN, SINGAPORE, 23885, SINGAPORE
Covered Property (1)
Flexible Packaging Film Laminates and Method of Making Same via Thermal Lamination
Application: 17/622,586 →
Publication: US 2022/0355574
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 28, 2021
From: DOW CHEMICAL PACIFIC (SINGAPORE) PRIVATE LIMITED
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 058492/0302 →
Assignment of Assignor's Interest Dec 28, 2021
From: THAI, HWEE TATZ
To: PERFORMANCE MATERIALS NA, INC.
Reel/Frame 058492/0336 →
Assignment of Assignor's Interest Dec 28, 2021
From: PERFORMANCE MATERIALS NA, INC.
To: THE DOW CHEMICAL COMPANY
Reel/Frame 058492/0375 →
Assignment of Assignor's Interest Dec 28, 2021
From: THE DOW CHEMICAL COMPANY
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 058492/0401 →