Patent Assignment
Reel/Frame 058607/0393
Change of Name
Recorded: 2022-01-04
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Temporary Protective Film for Semiconductor Encapsulationmolding, Lead Frame Provided with Temporary Protective Film, Encapsulated Molded Body Provided with Temporary Protectivefilm, and Method for Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2020
From: KURODA, TAKAHIRO; NAGOYA, TOMOHIRO; TOMORI, NAOKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053737/0688 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →