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Patent Assignment
Reel/Frame 058625/0583

Assignment of Assignor's Interest

Recorded: 2022-01-11 Pages: 7
Assignor
MONOLITHIC 3D INC.
Executed: 2022-01-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON CITY, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Properties (4)
Method for Fabrication of a Semiconductor Device and Structure
Patent: 8,557,632 →
Application: 13/441,923 →
Publication: US 2013/0267046
Novel Method of Processing a Semiconductor Device
Patent: 9,911,627 →
Application: 13/864,244 →
3DIC Device with Memory
Application: 15/727,592 →
Publication: US 2018/0033881
3D Semiconductor Device and Structure
Application: 15/904,377 →
Publication: US 2018/0190619
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2013
From: OR-BACH, ZVI; SEKAR, DEEPAK; CRONQUIST, BRIAN
To: MONOLITHIC 3D INC.
Reel/Frame 029623/0439 →
Assignment of Assignor's Interest Apr 18, 2013
From: OR-BACH, ZVI; CRONQUIST, BRIAN; SEKAR, DEEPAK
To: MONOLITHIC 3D INC.
Reel/Frame 030241/0821 →
Assignment of Assignor's Interest Mar 22, 2018
From: OR-BACH, ZVI; CRONQUIST, BRIAN; SEKAR, DEEPAK
To: MONOLITHIC 3D INC.
Reel/Frame 045316/0985 →
Assignment of Assignor's Interest May 3, 2018
From: OR-BACH, ZVI; SEKAR, DEEPAK; CRONQUIST, BRIAN
To: MONOLITHIC 3D INC.
Reel/Frame 045712/0367 →
Assignment of Assignor's Interest Jan 5, 2022
From: OR-BACH, ZVI; WIDJAJA, YUNIARTO
To: MONOLITHIC 3D INC.
Reel/Frame 058560/0734 →