IP Library › Assignment 058632/0296
Patent Assignment
Reel/Frame 058632/0296

Assignment of Assignor's Interest

Recorded: 2022-01-12 Pages: 3
Assignors
CHIN, SHU-CHENG
Executed: 2021-12-27
CHI, CHIH-CHIEN
Executed: 2021-12-27
LIN, CHI-FENG
Executed: 2021-12-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Conductive Structures with Barriers and Liners of Varying Thicknesses
Application: 17/647,748 →
Publication: US 2023/0154792
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 058632 Frame: 0296. Assignor(S) Hereby Confirms the Assignment. May 12, 2022
From: CHIN, SHU-CHENG; CHI, CHIH-CHIEN; LIN, CHI-FENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 059988/0960 →