Patent Assignment
Reel/Frame 058670/0634
Assignment of Assignor's Interest
Recorded: 2022-01-17
Pages: 4
Assignors
YU, DE-WEI
Executed: 2022-01-11
HSIEH, MING-FENG
Executed: 2022-01-16
SUNG, HSUEH-CHANG
Executed: 2022-01-11
JENG, PEI-REN
Executed: 2022-01-11
YEO, YEE-CHIA
Executed: 2022-01-11
CHENG, CHIEN-CHIA
Executed: 2022-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fin Bending Reduction Through Structure Design