Patent Assignment
Reel/Frame 058674/0709
Assignment of Assignor's Interest
Recorded: 2022-01-18
Pages: 3
Assignors
LEE, KYUNG RYUL
Executed: 2021-06-10
JEONG, JONG SUK
Executed: 2021-06-10
CHOI, CHANG HAK
Executed: 2021-06-10
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component