Patent Assignment
Reel/Frame 058718/0916
Assignment of Assignor's Interest
Recorded: 2022-01-21
Pages: 6
Assignors
PARK, JINWOO
Executed: 2021-12-17
LEE, JONGHO
Executed: 2021-12-17
KO, YEONGKWON
Executed: 2021-12-17
LEE, TEAKHOON
Executed: 2021-12-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Semiconductor Package