IP Library › Assignment 058730/0435
Patent Assignment
Reel/Frame 058730/0435

Assignment of Assignor's Interest

Recorded: 2022-01-21 Pages: 4
Assignors
KATO, TOMOKO
Executed: 2019-01-31
KODAMA, HARUMI
Executed: 2019-02-08
FUJISAWA, TOYOHIKO
Executed: 2019-02-12
ONISHI, MASAYUKI
Executed: 2019-02-13
Assignee
DOW CORNING TORAY COMPANY, LTD.
23F OTEMACHI FIRST SQUARE BUILDING, OTEMACHI, CHIYODA-KU, TOKYO, 100-004, JAPAN
Covered Property (1)
Thermally Conductive Silicone Compound
Application: 16/345,704 →
Publication: US 2019/0345291