Patent Assignment
Reel/Frame 058746/0770
Assignment of Assignor's Interest
Recorded: 2022-01-24
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Die and Method for Forming the Same