Patent Assignment
Reel/Frame 058781/0125
Assignment of Assignor's Interest
Recorded: 2022-01-26
Pages: 2
Assignors
SHIMIZU, TAKEKI
Executed: 2021-10-19
HIRATA, TATSUYA
Executed: 2021-10-19
MATSUMOTO, SUZUKA
Executed: 2021-10-19
Assignee
ASAHI KASEI KABUSHIKI KAISHA
1-1-2 YURAKUCHO, CHIYODA-KU, TOKYO, 1000006, JAPAN
Covered Property
(1)
Negative Photosensitive Resin Composition, Production Method for Polyimide, Production Method for Cured Relief Pattern, and Semiconductor Device