Patent Assignment
Reel/Frame 058797/0159
Assignment of Assignor's Interest
Recorded: 2022-01-27
Pages: 4
Assignors
HSIAO, TSUNG-CHIEH
Executed: 2022-01-09
SHEN, HSIANG-KU
Executed: 2022-01-09
HSIAO, YUAN-YANG
Executed: 2022-01-10
HUANG, CHEN-CHIU
Executed: 2022-01-09
CHEN, DIAN-HAU
Executed: 2022-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Back-End-Of-Line Passive Device Structure