Patent Assignment
Reel/Frame 058799/0812
Assignment of Assignor's Interest
Recorded: 2022-01-27
Pages: 5
Assignors
LIN, MENG-HAN
Executed: 2022-01-14
HUANG, CHIA-EN
Executed: 2022-01-14
CHIA, HAN-JONG
Executed: 2022-01-16
LIU, YI-CHING
Executed: 2022-01-16
WANG, SHENG-CHEN
Executed: 2022-01-14
YANG, FENG-CHENG
Executed: 2022-01-17
LIN, CHUNG-TE
Executed: 2022-01-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device Comprising Second Memory Cell Having First Thermal Coupled to First Signal Line Through First Memory Cell