Patent Assignment
Reel/Frame 058816/0257
Assignment of Assignor's Interest
Recorded: 2022-01-28
Pages: 5
Assignors
HUANG, LIN-YU
Executed: 2020-08-11
YU, LI-ZHEN
Executed: 2020-08-12
CHANG, CHIA-HAO
Executed: 2020-08-11
CHUANG, CHENG-CHI
Executed: 2020-08-11
CHENG, KUAN-LUN
Executed: 2020-08-11
WANG, CHIH-HAO
Executed: 2020-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Backside via and Method of Fabricating Thereof