Patent Assignment
Reel/Frame 058843/0221
Assignment of Assignor's Interest
Recorded: 2022-02-01
Pages: 2
Assignor
NAKAJIMA, AKIRA
Executed: 2022-01-17
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having an Interconnection Including Plural Metal Layers, and Manufacturing Method Thereof