Patent Assignment
Reel/Frame 058855/0739
Assignment of Assignor's Interest
Recorded: 2022-02-02
Pages: 4
Assignors
JUNG, JAEMIN
Executed: 2021-08-18
HA, JEONGKYU
Executed: 2021-08-18
HAN, SANGUK
Executed: 2021-08-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Package and Display Apparatus Including the Same