Patent Assignment
Reel/Frame 058880/0418
Assignment of Assignor's Interest
Recorded: 2022-02-03
Pages: 4
Assignors
BOO, KELVIN TAN AIK
Executed: 2022-02-02
NG, HONG WAN
Executed: 2022-02-02
YE, SENG KIM
Executed: 2022-02-02
CHONG, CHIN HUI
Executed: 2022-02-02
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Three-Dimensional Bonding Scheme and Associated Systems and Methods