IP Library Assignment 058882/0202
Patent Assignment
Reel/Frame 058882/0202

Assignment of Assignor's Interest

Recorded: 2022-02-03 Pages: 3
Assignors
FUJII, HIDETOSHI
Executed: 2022-01-06
MORISADA, YOSHIAKI
Executed: 2022-01-05
AOKI, YASUHIRO
Executed: 2022-01-06
Assignee
OSAKA UNIVERSITY
1-1, YAMADAOKA, SUITA-SHI, OSAKA, 565-0871, JAPAN
Covered Property (1)
Dissimilar Material Solid Phase Bonding Method, and Dissimilar Material Solid Phase Bonded Structure
Application: 17/632,714 →