Patent Assignment
Reel/Frame 058886/0552
Assignment of Assignor's Interest
Recorded: 2022-02-04
Pages: 5
Assignors
WANG, SW
Executed: 2017-07-20
LIEW, HOW KIAT
Executed: 2017-07-20
CHEW, CH
Executed: 2017-07-20
KUROSE, EIJI
Executed: 2017-07-18
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Molded Semiconductor Package and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
Release of Security Interest in Patents Recorded at Reel 059847, Frame 0433
Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →