Patent Assignment
Reel/Frame 065525/0001
Release of Security Interest in Patents Recorded at Reel 059847, Frame 0433
Recorded: 2023-11-09
Pages: 430
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Properties
(64)
Gapless Image Sensor Packages and Related Methods
Adaptive Radio
Application:
17/572,874 →
Publication:
US 2022/0225152
Image Sensor Packages Formed Using Temporary Protection Layers and Related Methods
DSI3 Bus with Enhanced Robustness
Semiconductor Package
Lidar Systems with Reduced Inter-Chip Data Rate
Application:
17/646,936 →
Publication:
US 2023/0213626
Current-Mode Control for Multistage Interleaved Resonant Converters
Switching Slew Rate Control for Gate Drivers
Image Sensors with Variable Resolution Image Format
Transistor Structures
Image Pixels Having Ir Sensors with Reduced Exposure to Visible Light
Application:
17/647,999 →
Publication:
US 2023/0230989
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Electronic Device Including a Semiconductor Layer Within a Trench and a Semiconductor Layer and a Process of Forming the Same
Electrical Interconnection of Image Sensor Package
Pixel Circuitry with Voltage-Domain Sampling
Molded Semiconductor Package and Related Methods
Methods and System for a Battery
High Power Module Package Structures
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Shielded Gate Trench Power Mosfet with High-K Shield Dielectric
Auto-Tuner for Resonant Circuit
Illumination Diagnosis for Lidar Driver
Time-Of-Flight Sensing System
Gate Driver with Thermal Monitoring and Current Sensing
Structures for Aligning a Semiconductor Wafer for Singulation
Clips for Semiconductor Package and Related Methods
Application:
17/651,621 →
Publication:
US 2022/0173022
Microlenses for Semiconductor Device with Single-Photon Avalanche Diode Pixels
Vernier Sensor with Self Calibration
Semiconductor Device Manufacturing Assembly for Solder Bump Formation Using a Wafer with Ring
Application:
17/652,877 →
Publication:
US 2022/0181192
Ground Fault Interrupter Self Test Circuits and Related Methods
Process of Forming an Electronic Device Including a Component Structure Adjacent to a Trench
Forming Shield Contacts in a Shielded-Gate Trench Power Mosfet
Application:
17/653,235 →
Publication:
US 2022/0310813
Trench Channel Semiconductor Devices and Related Methods
Application:
17/653,669 →
Publication:
US 2023/0282693
Gate Driver
Current Limiting Circuit
Bond Wire Loss Detection and Redundancy
Application:
17/654,847 →
Publication:
US 2023/0298950
Methods and Systems of Detecting Faults in Circuits Driving Average-Current Loads
Application:
17/654,951 →
Publication:
US 2022/0312568
Average Inductor Current Control with Open- and Closed-Loop Regulation
Power Module
Structure and Method Related to a Power Module Using a Hybrid Spacer
Shield Contact Layout for Power Mosfets
Application:
17/655,579 →
Publication:
US 2022/0310802
Systems and Methods for Temperature Measurements
Controllable Gap Height for an Image Sensor Package
Image Pixels with Coupled-Gates Structures
Versatile Low Noise Amplifier and Method Therefor
Fast, Low-Power Receive Signal Strength Indicator (Rssi) Circuit and Method Therefor
Linear Inductive Position Sensor
Hearables and Hearing Aids with Proximity-Based Adaptation
Direction-Dependent Single-Source Forward Cancellation
Patent:
11,699,426 →
Application:
17/670,258 →
Hybrid Sector Selection and Beamforming
Coexistence Management in Wireless Communications
Wireless Transceiver
Out of Order Packet Scheduler
Wireless Data Transmission
Secure Serial Bus with Automotive Applications
Frame Rate Driven Communication
Equalization of Digital Pre-Distortion Signal
Application:
17/710,500 →
Publication:
US 2023/0318638
Nanophotonic Color Filter and Lens
Application:
63/266,804 →
Method to Improve Blooming in Overflow Mode Pixel
Application:
63/268,736 →
Bandgap Circuit
Application:
63/269,051 →
Electrochemical Readout Circuit
Application:
63/269,052 →
Integrated Shunt Current Sense Amplifier
Application:
63/297,329 →
Module Having Balanced Current Density and Low Stray Inductance
Application:
63/299,147 →
Method of Synchronous Rectification Control in Llc Topology
Application:
63/362,172 →
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2022
From: MAZGUT, ROMAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058542/0715 →
Assignment of Assignor's Interest
Jan 4, 2022
From: KOUDAR, IVAN; LEDVINA, JAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058542/0189 →
Assignment of Assignor's Interest
Jan 10, 2022
From: BORTHAKUR, SWARNAL
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058607/0308 →
Assignment of Assignor's Interest
Jan 11, 2022
From: PTACEK, KAREL; STULER, ROMAN; RADVAN, ROMAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058617/0044 →
Assignment of Assignor's Interest
Jan 13, 2022
From: GUIDASH, ROBERT MICHAEL; RAHMAN, MUHAMMAD MAKSUDUR
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058650/0600 →
Assignment of Assignor's Interest
Jan 13, 2022
From: HUGGETT, ANTHONY RICHARD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058643/0935 →
Assignment of Assignor's Interest
Jan 14, 2022
From: BORTHAKUR, SWARNAL; PERKINS, ANDREW EUGENE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058656/0859 →
Assignment of Assignor's Interest
Jan 14, 2022
From: KINSMAN, LARRY DUANE; BORTHAKUR, SWARNAL; SULFRIDGE, MARC ALLEN; CHURCHWELL, SCOTT DONALD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058660/0783 →
Assignment of Assignor's Interest
Jan 26, 2022
From: HUSTAVA, MAREK; SUCHY, TOMAS
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058784/0251 →
Assignment of Assignor's Interest
Jan 27, 2022
From: VAVRO, JURAJ
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058792/0401 →
Assignment of Assignor's Interest
Jan 28, 2022
From: WALL, RALPH N.; LAPPAN, RAYMOND
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058815/0089 →
Assignment of Assignor's Interest
Jan 28, 2022
From: SCHULTZ, STEPHEN MICHAEL; TAN, GUOBING; KHELGHATI, HOJAT TOLLAH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058810/0784 →
Assignment of Assignor's Interest
Jan 31, 2022
From: PRAJUCKAMOL, ATAPOL; CHEW, CHEE HIONG; YAO, YUSHANG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058829/0458 →
Assignment of Assignor's Interest
Feb 2, 2022
From: HSU, SHOU-CHIAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058857/0697 →
Assignment of Assignor's Interest
Feb 3, 2022
From: INNOCENT, MANUEL H.; GEURTS, TOMAS; CHAPINAL GOMEZ, GENIS; FUNG, TZE CHING
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058874/0074 →
Assignment of Assignor's Interest
Feb 4, 2022
From: WANG, SW; LIEW, HOW KIAT; CHEW, CH; KUROSE, EIJI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058886/0552 →
Assignment of Assignor's Interest
Feb 4, 2022
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058888/0768 →
Assignment of Assignor's Interest
Feb 8, 2022
From: IM, SEUNGWON; EOM, JOOYANG; YOO, INPIL; JEON, OSEOB
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058922/0646 →
Security Interest
May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
Release of Security Interest
May 2, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 063516/0756 →
Assignment of Assignor's Interest
May 8, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: MAXLINEAR, INC.
Reel/Frame 063572/0701 →