IP Library Granted Patent US 12,604,551
Granted Patent B2
US 12,604,551 · App. 17/647,999 · Granted Apr 14, 2026

Image pixels having IR sensors with reduced exposure to visible light

Inventors: Swarnal Borthakur (Boise, ID); Andrew Eugene Perkins (Boise, ID)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H10F39/8063H10F39/184H10F39/8053H10F71/00
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Quick Facts
Patent No.
US 12,604,551
App. No.
17/647,999
Granted
Apr 14, 2026
Kind
B2
Abstract

Image pixels having IR sensors with reduced exposure to visible light. One example is an image sensor comprising: a photosensitive region; a lower optical filter above the photosensitive region, and the lower optical filter configured to filter visible light and to pass infrared light; and an upper optical filter above the lower optical filter, and the upper optical filter configured to filter visible light and to pass infrared light.

Claims (41)

1 . An image sensor comprising:

a photosensitive region;

a lower optical filter above the photosensitive region, and the lower optical filter configured to block visible light and to pass infrared light;

an upper optical filter above the lower optical filter, and the upper optical filter configured to block visible light and to pass infrared light;

an oxide layer between the upper optical filter and the lower optical filter;

a silicon dioxide layer between the photosensitive region and the oxide layer; and

a grid of metallic material embedded in the oxide layer and abutting the silicon dioxide layer,

wherein the lower optical filter abuts the silicon dioxide layer and the grid of metallic material.

2 . The image sensor of claim 1 further comprising

the lower optical filter disposed between the upper optical filter and the grid of metallic material.

3 . The image sensor of claim 2 further comprising the lower optical filter disposed in a conformal arrangement on the grid of metallic material.

4 . The image sensor of claim 1 further comprising the lower optical filter abutting the oxide layer, the oxide layer further disposed between the upper optical filter and the photosensitive region, the oxide layer comprising at least one selected from a group consisting of: aluminum oxide and tantalum oxide; hafnium oxide and tantalum oxide; aluminum-hafnium-oxide and tantalum oxide; and aluminum oxide and hafnium oxide.

5 . The image sensor of claim 1 wherein the lower optical filter is at least one selected from a group consisting of: aluminum nitride (AlN); and aluminum antimonide (AlSb).

6 . An imaging system comprising:

a lens system;

an image sensor in operational relationship to the lens system;

an imaging system controller electrically coupled to the image sensor;

the image sensor comprising an array of image pixels, at least one image pixel of the array of image pixels having an IR sensor, and the IR sensor comprising:

a photosensitive region defining a perimeter;

a lower optical filter above the photosensitive region, the lower optical filter defines a perimeter coextensive with the perimeter of the photosensitive region, and the lower optical filter configured to block visible light and to pass infrared light;

an upper optical filter above the lower optical filter, the upper optical filter defines a perimeter coextensive with the perimeter of the photosensitive region, and the upper optical filter configured to block visible light and to pass infrared light;

an oxide layer between the upper optical filter and the lower optical filter;

a silicon dioxide layer between the photosensitive region and the oxide layer; and

a grid of metallic material embedded in the oxide layer and abutting the silicon dioxide layer,

wherein the lower optical filter abuts the silicon dioxide layer and the grid of metallic material.

7 . The imaging system of claim 6 wherein the image sensor further comprises:

the lower optical filter disposed between the upper optical filter and the grid of metallic material.

8 . The imaging system of claim 7 wherein the image sensor further comprises the lower optical filter disposed in a conformal arrangement on the grid of metallic material.

9 . The imaging system of claim 6 wherein the lower optical filter is at least one selected from a group consisting of: aluminum nitride (AlN); and aluminum antimonide (AlSb).

10 . The imaging system of claim 6 wherein the imaging system is at least one selected from a group consisting of: an automobile; a vehicle; a camera; a cellular telephone; a tablet computer; a webcam; a video camera; a video surveillance system; and a video gaming system.

11 . A method of constructing an image sensor, the method comprising:

forming an image pixel comprising a plurality of sensors, each sensor having a photosensitive region;

placing an upper optical filter over the photosensitive region of a first sensor of the plurality of sensors, the upper optical filter passes infrared light and blocks visible light;

placing a lower optical filter over the photosensitive region of the first sensor, the lower optical filter passes infrared light and blocks visible light;

placing an oxide layer between the upper optical filter and the lower optical filter;

placing a silicon dioxide layer between the photosensitive region and the oxide layer; and

placing a grid of metallic material embedded in the oxide layer and abutting the silicon dioxide layer,

wherein the lower optical filter abuts the silicon dioxide layer and the grid of metallic material.

12 . The method of claim 11 wherein placing the upper optical filter further comprises placing the upper optical filter between a microlens for the first sensor and the grid of metallic material.

13 . The method of claim 12 wherein placing the lower optical filter further comprises placing the lower optical filter in a conformal arrangement on the grid of metallic material and in a layer between the upper optical filter and the grid of metallic material.

14 . The method of claim 11 wherein the lower optical filter is at least one selected from a group consisting of: aluminum nitride (AlN); and aluminum antimonide (AlSb).

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 059847, FRAME 0433 Recorded Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →
SECURITY INTEREST Recorded May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2022
From: BORTHAKUR, SWARNAL; PERKINS, ANDREW EUGENE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 058656/0859 →
Continuity (1)
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