IP Library Granted Patent US 12,585,018
Granted Patent B2
US 12,585,018 · App. 17/651,140 · Granted Mar 24, 2026

Time-of-flight sensing system

Inventor: Marko Mlinar (Horjul, SI)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
G01S17/89G01S7/4863G01S7/4914
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Quick Facts
Patent No.
US 12,585,018
App. No.
17/651,140
Granted
Mar 24, 2026
Kind
B2
Abstract

A time-of-flight (TOF) sensing system may include an illumination module and a sensor module. The sensor module may include an array of sensor pixels, each sensor pixel configured to perform multiple measurements to generate corresponding pixel data for a TOF sensing operation. Signal processing circuitry may generate phase data based on the pixel data. Phase denoise circuitry in the signal processing circuitry may perform different types of filtering operations on the phase data such as perform two bilateral filters of varying strengths. The lower-fidelity denoised phase data may be used for depth disambiguation, while the higher-fidelity denoised phase data may be used for depth calculation. If desired, the phase denoise circuitry may perform averaging operations for one or both of these filtering operations using a Cartesian coordinate representation and efficiently using piecewise linear trigonometric approximations.

Claims (32)

1 . A sensor module configured to perform time-of-flight sensing comprising:

an array of sensor pixels configured to generate pixel data indicative of phase data for a time-of-flight sensing operation; and

signal processing circuitry having phase denoise circuitry configured to perform a first filtering operation on the phase data using a first filter of a first type to generate first denoised phase data and to perform a second filtering operation on the phase data using a second filter of a second type to generate second denoised phase data, wherein the first and second filters each use phase data from multiple sensor pixels.

2 . The sensor module defined in claim 1 , wherein the signal processing circuitry comprises depth disambiguation circuitry configured to receive the second denoised phase data and depth calculation circuitry configured to receive the first denoised phase data.

3 . The sensor module defined in claim 2 , wherein the depth calculation circuitry is configured to generate first depth data based on the first denoised phase data and to generate second depth data based on the second denoised phase data.

4 . The sensor module defined in claim 3 , wherein the signal processing circuitry is configured to merge the first and second depth data to generate a depth map for the time-of-flight sensing operation.

5 . The sensor module defined in claim 1 , wherein the first filter and the second filter differ in filter strength.

6 . The sensor module defined in claim 5 , wherein the first filter is a bilateral filter and the second filter is a bilateral filter.

7 . The sensor module defined in claim 5 , wherein the second filter uses phase data from a first number of sensor pixels and the first filter uses phase data from a second number of sensor pixels that is less than the first number of sensor pixels.

8 . The sensor module defined in claim 5 , wherein the second filter implements an infinite impulse response filter and the first filter implements a finite impulse response filter.

9 . A signal processor configured to receive time-of-flight sensing data associated with an array of pixels, the signal processor comprising:

phase calculation circuitry configured to receive the time-of-flight sensing data and to generate corresponding phase data based on the time-of-flight sensing data;

phase denoise circuitry configured to receive the phase data, to generate first denoised phase data by applying a first filter to the phase data, and to generate second denoised phase data by applying a second filter to the phase data;

depth disambiguation circuitry configured to receive the first denoised phase data and to perform a depth disambiguation operation based on the first denoised phase data; and

depth calculation circuitry configured to receive the second denoised phase data and to perform a depth calculation operation based on the second denoised phase data.

10 . The signal processor defined in claim 9 , further comprising:

additional depth calculation circuitry configured to receive the first denoised phase data and to perform an additional depth calculation operation based on the first denoised phase data.

11 . The signal processor defined in claim 10 , further comprising:

data merging circuitry configured to merge first depth data from the depth calculation operation based on the second denoised phase data with second depth data from the additional depth calculation operation based on the first denoised phase data.

12 . The signal processor defined in claim 9 , wherein the first filter is a bilateral filter and the second filter is a bilateral filter, and wherein each filtering operation using the first filter is based on phase data from a first number of pixels and each filtering operation using the second filter is based on phase data from a second number of pixels less than the first number of pixels.

13 . The signal processor defined in claim 9 , wherein the signal processor is configured to be implemented as a portion of a vehicular system.

14 . A sensor module configured to perform time-of-flight sensing comprising:

an array of sensor pixels configured to generate pixel data indicative of phase data for a time-of-flight sensing operation; and

phase denoise circuitry configured to perform a bilateral filtering operation on phase data from a center pixel using phase data from neighboring pixels to generate denoised phase data by:

determining a vector sum of pixel data from the center pixel and from the neighboring pixels; and

rotating vectors associated with the pixel data from the neighboring pixels relative to a vector associated with the pixel data from the center pixel.

15 . The sensor module defined in claim 14 , wherein the phase denoise circuitry is configured to perform a bilateral filtering operation further by approximating trigonometric functions using a set of linear functions.

16 . The sensor module defined in claim 15 , wherein determining the vector sum comprises using the set of linear functions to approximate trigonometric functions.

17 . The sensor module defined in claim 16 , wherein the phase denoise circuitry is configured to perform the bilateral filtering operation further by determining the denoised phase data based on the vector sum.

18 . The sensor module defined in claim 17 , wherein determining the denoised phase data based on the vector sum comprises using the set of linear functions to approximate trigonometric functions.

19 . The sensor module defined in claim 15 , wherein the phase denoise circuitry is configured to perform the bilateral filtering operation further by performing a bilateral filtering comparison operation to determine valid pixel data for the vector sum.

20 . The sensor module defined in claim 19 , wherein performing the bilateral filtering comparison operation comprises performing a comparison using components of vectors associated with the pixel data.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 059847, FRAME 0433 Recorded Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →
SECURITY INTEREST Recorded May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2022
From: MLINAR, MARKO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059016/0043 →
Continuity (1)
Related Publication 20230314615A1 · Oct 5, 2023
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