IP Library Assignment 058815/0089
Patent Assignment
Reel/Frame 058815/0089

Assignment of Assignor's Interest

Recorded: 2022-01-28 Pages: 6
Assignors
WALL, RALPH N.
Executed: 2022-01-28
LAPPAN, RAYMOND
Executed: 2022-01-28
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Electronic Device Including a Semiconductor Layer Within a Trench and a Semiconductor Layer and a Process of Forming the Same
Application: 17/649,299 →
Publication: US 2023/0282688
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
Release of Security Interest in Patents Recorded at Reel 059847, Frame 0433 Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →