Patent Assignment
Reel/Frame 058894/0672
Assignment of Assignor's Interest
Recorded: 2022-02-04
Pages: 3
Assignor
MURAKAMI, HIDEAKI
Executed: 2022-02-02
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Semiconductor Storage Device with Bonding Electrodes