Patent Assignment
Reel/Frame 058898/0433
Assignment of Assignor's Interest
Recorded: 2022-02-04
Pages: 4
Assignors
PARK, JONG HWI
Executed: 2022-01-24
KU, KAP-RYEOL
Executed: 2022-01-24
KIM, JUNG-GYU
Executed: 2022-01-24
CHOI, JUNG WOO
Executed: 2022-01-24
KYUN, MYUNG-OK
Executed: 2022-01-24
Assignee
SENIC INC.
17-15, 4SANDAN 7-RO, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, 31040, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer and Method of Manufacturing Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.