Patent Assignment
Reel/Frame 058928/0187
Assignment of Assignor's Interest
Recorded: 2022-02-08
Pages: 6
Assignors
HWANG, HYUN SU
Executed: 2022-01-12
KWEON, JUN YUN
Executed: 2022-01-12
PARK, JUM YONG
Executed: 2022-01-12
SONG, SOL JI
Executed: 2022-01-12
OH, DONG JOON
Executed: 2022-01-12
LEE, CHUNG SUN
Executed: 2022-01-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same