Patent Assignment
Reel/Frame 058941/0715
Assignment of Assignor's Interest
Recorded: 2022-02-09
Pages: 7
Assignors
OKANIWA, MASASHI
Executed: 2022-01-26
TAKANO, KENTARO
Executed: 2022-01-27
KIDA, TSUYOSHI
Executed: 2022-01-26
Assignee
MITSUBISHI GAS CHEMICAL COMPANY, INC.
5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 1008324, JAPAN
Covered Property
(1)
Resin Composition, Resin Sheet, Laminate, Semiconductor Wafer with Resin Composition Layer, Substrate for Mounting Semiconductor with Resin Composition Layer, and Semiconductor Device