Patent Assignment
Reel/Frame 058977/0179
Assignment of Assignor's Interest
Recorded: 2022-02-10
Pages: 6
Assignors
YU, BONGWEE
Executed: 2021-09-08
LEE, IKU
Executed: 2021-09-08
LEE, JAEGON
Executed: 2021-09-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
System on Chip Controlling Connection of Processing Unit to External Capacitor to Reduce Voltage Droop and Electronic System Including the Same