Patent Assignment
Reel/Frame 059005/0638
Assignment of Assignor's Interest
Recorded: 2022-02-14
Pages: 5
Assignors
TU, YEN-CHU
Executed: 2022-02-08
TSAI, SHANG-LUN
Executed: 2022-01-02
LIU, MONSEN
Executed: 2022-01-02
CHEN, SHUO-MAO
Executed: 2022-01-03
JENG, SHIN-PUU
Executed: 2022-01-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Forming the Same