Patent Assignment
Reel/Frame 059012/0428
Assignment of Assignor's Interest
Recorded: 2022-02-15
Pages: 6
Assignors
PARK, KWANGWUK
Executed: 2022-01-19
LEE, YOUNGMIN
Executed: 2022-01-19
LEE, INYOUNG
Executed: 2022-01-17
CHO, SUNGDONG
Executed: 2022-01-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Including Buried Dielectric Pattern at Edge Region, Semiconductor Package Including the Same, and Method of Fabricating the Same