Patent Assignment
Reel/Frame 059017/0883
Assignment of Assignor's Interest
Recorded: 2022-02-15
Pages: 3
Assignors
CHIU, CHIH-YUAN
Executed: 2022-01-27
CHEN, SHIH-YEN
Executed: 2022-02-06
PENG, CHI-CHUN
Executed: 2022-01-31
CHEN, HONG-KUN
Executed: 2022-01-28
LIN, HUI-TING
Executed: 2022-02-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Bonding Tool and Bonding Method Thereof