Patent Assignment
Reel/Frame 059020/0394
Assignment of Assignor's Interest
Recorded: 2022-02-15
Pages: 5
Assignors
WANG, WEI-JEN
Executed: 2022-02-11
CHENG, PO-JEN
Executed: 2022-01-13
CHEN, FU-YUAN
Executed: 2022-01-13
CHEN, KAO HSIN
Executed: 2022-01-13
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Electronic Package Structure and Method for Manufacturing the Same
Application:
17/548,328 →
Publication:
US 2023/0187367