IP Library Assignment 059032/0509
Patent Assignment
Reel/Frame 059032/0509

Assignment of Assignor's Interest

Recorded: 2022-02-17 Pages: 3
Assignor
CHEN, BO-YEN
Executed: 2022-01-19
Assignee
WISTRON NEWEB CORPORATION
20 PARK AVENUE II, HSINCHU SCIENCE PARK, HSINCHU, 308, TAIWAN
Covered Property (1)
Heat Dissipation Structure with Stacked Thermal Interface Materials
Application: 17/673,950 →
Publication: US 2022/0408603
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 29, 2025
From: WISTRON NEWEB CORPORATION
To: WNC CORPORATION
Reel/Frame 072255/0226 →