Heat dissipation structure with stacked thermal interface materials
A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.
1. A heat dissipation structure, comprising:
a heat sink;
a first thermal interface material connected to the heat sink and having fluidity;
a second thermal interface material connected to the first thermal interface material and having no fluidity;
a circuit board connected to the second thermal interface material and having an opening, a top board surface and a bottom board surface; and
a circuit element comprising:
a convex portion having a top convex surface and disposed in the opening; and
a base portion connected to the convex portion and the bottom board surface;
wherein the heat sink, the first thermal interface material, the second thermal interface material, the circuit board and the circuit element are connected in sequence, and the second thermal interface material is connected to the top board surface and the top convex surface.
2. The heat dissipation structure of claim 1 , wherein the circuit element is an antenna module, the antenna module comprises at least one antenna, the base portion has a top surface and a bottom surface, the top surface and the bottom surface are disposed on two opposite sides of the base portion, respectively, the top surface faces toward the circuit board, and the at least one antenna is disposed on the bottom surface.
3. The heat dissipation structure of claim 1 , wherein the first thermal interface material has a flow rate, and the first thermal interface material is only connected between the heat sink and the second thermal interface material.
4. The heat dissipation structure of claim 1 , wherein the top convex surface is disposed in the opening, and a convex surface area of the top convex surface is smaller than a hole area of the opening.
5. The heat dissipation structure of claim 4 , wherein an edge of the opening is spaced from a side edge of the convex portion by a gap.
6. The heat dissipation structure of claim 1 , wherein an interface material area of the second thermal interface material is greater than a hole area of the opening, and the second thermal interface material covers the opening and a part of the top board surface to seal the opening.
7. The heat dissipation structure of claim 1 , wherein the heat sink, the first thermal interface material, the second thermal interface material and the circuit element are connected in sequence at an area position corresponding to the opening.
8. A heat dissipation structure, comprising:
a heat sink;
a first thermal interface material connected to the heat sink and having fluidity;
a second thermal interface material connected to the first thermal interface material and having no fluidity;
a circuit board connected to the second thermal interface material and having a plurality of openings, a top board surface and a bottom board surface; and
a plurality of circuit elements, wherein each of the circuit elements comprises:
a convex portion having a top convex surface and disposed in one of the openings; and
a base portion connected to the convex portion and the bottom board surface;
wherein the heat sink, the first thermal interface material, the second thermal interface material, the circuit board and the circuit elements are connected in sequence, and the second thermal interface material is connected to the top board surface and the top convex surface of the convex portion of each of the circuit elements.
9. The heat dissipation structure of claim 8 , wherein each of the circuit elements is an antenna module, the antenna module comprises at least one antenna, the base portion has a top surface and a bottom surface, the top surface and the bottom surface are disposed on two opposite sides of the base portion respectively, the top surface faces toward the circuit board, and the at least one antenna is disposed on the bottom surface.
10. The heat dissipation structure of claim 8 , wherein an interface material area of the second thermal interface material is greater than a hole area of each of the openings, and the second thermal interface material covers each of the openings and a part of the top board surface to seal each of the openings.