Patent Assignment
Reel/Frame 059048/0632
Assignment of Assignor's Interest
Recorded: 2022-02-18
Pages: 3
Assignor
OGAWA, ARITO
Executed: 2022-01-31
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium