Patent Assignment
Reel/Frame 059059/0803
Assignment of Assignor's Interest
Recorded: 2022-02-21
Pages: 4
Assignors
WENG, CHUNG-MING
Executed: 2022-02-07
TSAI, HAO-YI
Executed: 2022-02-10
HSIEH, CHENG-CHIEH
Executed: 2022-02-07
KUO, HUNG-YI
Executed: 2022-02-07
YU, TSUNG-YUAN
Executed: 2022-02-07
CHEN, YU-HAO
Executed: 2022-02-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure, Semiconductor Device and Method of Fabricating the Same