Patent Assignment
Reel/Frame 059062/0284
Assignment of Assignor's Interest
Recorded: 2022-02-22
Pages: 6
Assignors
MYERS, PRESTON T.
Executed: 2017-10-23
FALCON, JAVIER A.
Executed: 2017-10-20
LIFF, SHAWNA M.
Executed: 2017-11-07
SAUCEDO, JOE R.
Executed: 2017-10-20
ELSHERBINI, ADEL A.
Executed: 2017-10-19
LOPEZ, ALBERT S.
Executed: 2017-10-23
SWAN, JOHANNA M.
Executed: 2017-10-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Tsv-Less Die Stacking Using Plated Pillars/Through Mold Interconnect