Patent Assignment
Reel/Frame 059063/0542
Assignment of Assignor's Interest
Recorded: 2022-02-22
Pages: 6
Assignors
PARK, JUN HYEONG
Executed: 2022-02-17
KIM, JIN YOUNG
Executed: 2022-02-17
SEO, YOUNG KWAN
Executed: 2022-02-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method for Fabricating the Same