Patent Assignment
Reel/Frame 059070/0643
Assignment of Assignor's Interest
Recorded: 2022-02-22
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure, Semiconductor Device Comprising Grating Coupler and Reflector Structure Embedded in the Dielectric Layer