Patent Assignment
Reel/Frame 059084/0130
Assignment of Assignor's Interest
Recorded: 2022-02-24
Pages: 3
Assignors
WU, JIUN-YI
Executed: 2022-02-08
YU, CHEN-HUA
Executed: 2022-02-08
LIANG, YU-MIN
Executed: 2022-02-08
CHENG, JUNG-WEI
Executed: 2022-02-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Forming Method Thereof