Patent Assignment
Reel/Frame 059089/0066
Assignment of Assignor's Interest
Recorded: 2022-02-24
Pages: 4
Assignor
HONDA, TAKUMI
Executed: 2022-02-18
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Substrate Processing Apparatus