Patent Assignment
Reel/Frame 059096/0428
Assignment of Assignor's Interest
Recorded: 2022-02-24
Pages: 3
Assignors
HUANG, CHIEN-YUAN
Executed: 2022-02-10
KU, SHIH-CHANG
Executed: 2022-02-10
WANG, CHUEI-TANG
Executed: 2022-02-11
YU, CHEN-HUA
Executed: 2022-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same