Patent Assignment
Reel/Frame 059100/0845
Assignment of Assignor's Interest
Recorded: 2022-02-25
Pages: 9
Assignors
HWANG, SUHYUNG
Executed: 2022-02-22
FANG, KUN
Executed: 2022-02-21
YEON, JAEHYUN
Executed: 2022-02-22
KIM, CHIN-KWAN
Executed: 2022-02-23
YANG, TAESIK
Executed: 2022-02-23
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Antenna Modules Employing a Package Substrate with a Vertically-Integrated Patch Antenna(S), and Related Fabrication Methods