Patent Assignment
Reel/Frame 059106/0469
Assignment of Assignor's Interest
Recorded: 2022-02-25
Pages: 5
Assignors
CHEN, GUOLIANG
Executed: 2022-02-17
LIU, MENGYONG
Executed: 2022-02-16
LIU, YANG
Executed: 2022-02-17
LIU, WU
Executed: 2022-02-17
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Wafer Bonding Apparatus and Method