Patent Assignment
Reel/Frame 059106/0759
Assignment of Assignor's Interest
Recorded: 2022-02-25
Pages: 8
Assignors
KIM, DOWON
Executed: 2021-12-28
MEI, SUOHAI
Executed: 2021-12-31
TADAYON, POOYA
Executed: 2021-12-27
GAMBA, JASON MICHAEL
Executed: 2022-01-05
GANESAN, SANKA
Executed: 2022-01-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Optical Packaging Using Embedded-in-Mold (Eim) Optical Module Integration
Application:
17/561,818 →
Publication:
US 2023/0204879