Patent Assignment
Reel/Frame 059109/0706
Assignment of Assignor's Interest
Recorded: 2022-02-27
Pages: 6
Assignors
JEON, HYUNG JUN
Executed: 2022-02-11
MOON, KWANG JIN
Executed: 2022-02-11
HWANG, SON-KWAN
Executed: 2022-02-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same