Patent Assignment
Reel/Frame 059122/0728
Assignment of Assignor's Interest
Recorded: 2022-02-28
Pages: 6
Assignors
NOMA, TAKASHI
Executed: 2019-07-10
OKUBO, NOBORU
Executed: 2019-07-10
LIN, YUSHENG
Executed: 2019-07-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Semiconductor Device Manufacturing Assembly for Solder Bump Formation Using a Wafer with Ring
Application:
17/652,877 →
Publication:
US 2022/0181192
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 059847/0433 →
Release of Security Interest in Patents Recorded at Reel 059847, Frame 0433
Nov 9, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065525/0001 →