Patent Assignment
Reel/Frame 059124/0873
Assignment of Assignor's Interest
Recorded: 2022-03-01
Pages: 10
Assignors
ZHANG, JOHN H
Executed: 2022-02-15
JI, BRIAN LI
Executed: 2022-02-14
LI, YANZUN
Executed: 2022-02-14
SADANA, DEVENDRA K
Executed: 2022-02-15
Assignee
HEFECHIP CORPORATION LIMITED
ROOM 3A, 12TH FLOOR, KAISER CENTRE, NO.18 CENTRE STREET, SAI YING PUN, HONG KONG
Covered Property
(1)
Semiconductor Structure and Fabrication Method Thereof